Dividers

Part No. BW(MHz) Freq. (MHz) I/L (dB) Iso. (dB) Phase Diff. Amplitude Diff. *Solder *PKG Application Note Impedance
BD09B 700-1000 Cellular, GSM900 750 0.49 20.2 0.5 Deg 0.02 dB with SOIC8   50 Ohm
850 0.49 28.3 0.5 0.02
950 0.58 20.1 0.6 0.03
750 0.5 20.6 0.2 Deg 0.01 dB without
850 0.52 27 0.2 0.01
950 0.59 19.5 0.4 0.01
BD0926 700-1000 Cellular,GSM900 750 0.55 22 0.2 Deg 0.01 dB without SOT26   50 Ohm
850 0.57 31.4 0.2 0.01
950 0.63 19 0.4 0.01
BD19B 1700-2300 PCS, WCDMA 1700 0.35 20.4 0.2 Deg 0.03 dB with SOIC8   50 Ohm
1900 0.38 24.4 0.3 0.04
2075 0.47 30.1 0.5 0.06
1700 0.38 20 1 Deg 0.06 dB without
1900 0.43 24.1 1 0.06
2075 0.54 25.4 0.9 0.05
BD1926 1700-2300 PCS, WCDMA 1700 0.51 20.1 1.4 Deg 0.04 dB without SOT26   50 Ohm
1900 0.55 24.8 1.5 0.07
2075 0.63 21.6 1.5 0.06
BD23B 1900-2500 PCS, WCDMA, WiBro, TD-SCDMA 1900 0.38 18.7 0.1 Deg 0.03 dB with SOIC8   50 Ohm
2075 0.39 21.6 0.2 0.04
2350 0.46 28.5 0.5 0.06
1900 0.36 19.2 1.7 Deg 0.07 dB without
2075 0.38 22.2 1.7 0.06
2350 0.49 25.8 1.7 0.06
BD2326 1900-2500 PCS, WCDMA, WiBro, TD-SCDMA 1900 0.58 23.3 0.7 Deg 0.03 dB without SOT26   50 Ohm
2075 0.59 27.5 0.7 0.04
2350 0.69 19.5 0.6 0.06
BD25B 1700-2500 PCS, PCS, USPCS, WCDMA, WiBro, TD-SCDMA 1800 0.38 20.8 0.2 Deg 0.07 dB with SOIC8   50 Ohm
2075 0.42 25.7 0.4 0.09
2350 0.6 22.2 0.7 0.12
1800 0.41 21.1 1.5 Deg 0.08 dB without
2075 0.49 26.3 1.7 0.11
2350 0.75 19 1.7 0.1
BD2626 2400-2900 WCDMA,WiBro,LTE 2400 0.61 23.3 0.75 Deg 0.07 dB without SOT26   50 Ohm
2500 0.59 25.1 0.75 0.07
2650 0.61 28.2 0.75 0.07
2800 0.66 25.8 0.75 0.09
2900 0.64 22 0.75 0.09